IEC/PAS 60191-6-18 Ed. 1.0 en:2008 PDF

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 09/01/1995

Standard Conditions for Use Prior to and During the Testing of Solid Electrical Insulating Materials - GERMAN ONLY

Published Date: 08/01/1995

Electromechanical Components for Electronic Equipment - Basic Testing Procedures and Measuring Methods - Part 2: General Examination, Electrical Continuity and Contact Resistance Tests, Insulation Tests and Voltage Stress Tests - GERMAN ONLY

Published Date: 05/01/1994

Electromechanical Components for Eelectronic Equipment; Basic Testing Procedures and Measuring Methods; Part 2: General Examination, Electrical Continuity and Contact Resistance Tests, Insulation Tests and Voltage Stress Tests - GERMAN ONLY

Published Date: 05/01/1994

Electromechanical Components for Electronic Equipment; Basic Testing Procedures and Measuring Methods; Part 3: Current-Carrying Capacity Tests - GERMAN ONLY

Published Date: 05/01/1994

Electromechanical Components for Electronic Equipment; Basic Testing Procedures and Measuring Methods; Part 4: Dynamic Stress Tests - GERMAN ONLY

Published Date: 05/01/1994

Electromechanical Components for Electronic Equipment; Basic Testing Procedures and Measuring Methods; part 5: Impact Tests (Free Components), Static Load Tests (Fixed Components), Endurance Tests and Overload Tests - GERMAN ONLY